Month: September 2026

Company outlines a $213 billion market opportunity as power becomes the foundational technology layer from infrastructure to physical applications

SCOTTSDALE, Ariz., Sept. 16, 2026 (GLOBE NEWSWIRE) — onsemi (NASDAQ: ON) today outlined its long-term growth strategy to lead one of the largest and most consequential technology shifts of the next decade by solving the growing power constraints limiting the advancement of AI, electrification and automation. As these markets converge around common technology requirements, onsemi is leveraging its differentiated portfolio across power and sensing to address a $213 billion market opportunity and solve the needs of some of the most important technology trends shaping the global economy.

“Every transformational technology eventually encounters a physical constraint. As AI, electrification and automation continue to scale, power density is emerging as one of the defining engineering challenges of this decade,” said Hassane El-Khoury, President and CEO of onsemi. “The companies that lead in the next era of innovation will be those that can deliver more energy while consuming less space. As that challenge becomes more urgent, power has become a foundational technology layer that will help shape the pace of innovation, economic growth and global competitiveness. We have spent years building deep expertise and a broad portfolio across power and sensing to help customers solve this challenge and enable the next generation of intelligent machines.”

Unlocking a $213 Billion Opportunity

onsemi sees a $213 billion total addressable market by 2030 spanning automotive, industrial, AI data center and emerging applications. Although these markets are often viewed separately, they increasingly rely on the same underlying capabilities: efficient power conversion, perception of the physical world, precision actuation and control, and connectivity.

This convergence allows onsemi to deploy common technology platforms across multiple end markets. A high-voltage technology developed for automotive electrification, for example, can also support industrial energy systems and AI data centers. Advances in sensing and connectivity can extend across vehicles, factories, robotics, medical systems and other autonomous applications.

The company expects this platform-based model to increase the revenue potential of its core technologies by moving from individual components to higher-value solutions and system architectures that address a larger share of each customer’s design requirements. Through this approach, onsemi can generate greater leverage from its R&D investments, reduce dependence on any single end market or technology cycle, and grow faster than the markets it serves.

“Throughout history, foundational technologies have created outsized value because they enable everything built above them,” El-Khoury said. “Power has become the common denominator across these end markets. For onsemi, that creates opportunities to innovate beyond any market trend, with multiple paths to expand content, gain share and capture more value.”

Solving the Next Challenge: Power Density

Capturing this opportunity requires addressing a growing constraint facing AI infrastructure and other intelligent systems – power density – or the ability to deliver greater performance and capability using less energy and less physical space.

Increasing power density requires electrical, thermal, mechanical and physical performance to be optimized simultaneously. Increasing power typically generates more heat, while reducing system size can make that heat more difficult to remove. Improving efficiency may require new materials, device architectures and integration methods. Historically, these trade-offs forced system designers to make compromises among power, size, cost and thermal performance.

As these challenges become more complex, value increasingly shifts to companies that can optimize across the entire system. onsemi has expanded beyond traditional power semiconductors to build capabilities spanning technologies, products, solutions and systems. onsemi highlighted three technology platforms that will shape the next generation of intelligent systems and drive long-term growth across its key end markets:

• High-Voltage Technologies: The Device Layer
  onsemi’s high-voltage portfolio spans silicon, silicon carbide (SiC) and gallium nitride (GaN), giving customers a range of options to optimize performance, efficiency, power density and cost. The portfolio includes vertical gallium nitride (vGaN), a differentiated technology, exclusive to onsemi, designed for next-generation high-voltage applications that can increase efficiency, improve switching performance and reduce system size where conventional power technologies are reaching their limits.

• Treo: The Intelligence Layer
  Modern systems must do more than convert power. They must monitor operating conditions, communicate across the system, respond to changing loads and protect critical functions in real-time. The Treo platform’s high precision analog, high density digital and high voltage capabilities, enable systems to become more precise, adaptive and autonomous. This allows onsemi to add these capabilities around the power device, increasing the functionality and value within a customer’s system.

• Embedded Power Platform (EPP): The Integration Layer
  EPP reimagines the package from passive housing into an active contributor to system performance. By using the silicon wafer itself as the package, EPP enables the seamless integration and interconnection of silicon, SiC and GaN technologies within a highly integrated wafer-level architecture. Multiple devices, including FETs, drivers and controllers, can be embedded together in a single package and co-optimized for electrical, thermal and mechanical performance. This enables complete power-system co-design, allowing electrical, thermal and mechanical characteristics to be evaluated and optimized together from day one. The result is higher power density, improved system performance, reduced development complexity and faster time-to-market.

As customers increasingly seek complete solutions rather than individual components, onsemi solves a larger portion of the customer’s challenge by reducing design complexity and accelerating development across automotive, industrial, AI data center and emerging applications. With this focus on the entire system-level solution, onsemi creates a competitive advantage that is difficult to replicate through individual components alone.

Beyond the Data Center: AI’s Next Frontier is the Physical World

While today’s AI investments are largely focused on building the infrastructure needed to train and run increasingly sophisticated models, the next phase of growth will occur at the edge, where intelligence moves beyond the data center into machines that interact directly with the physical world.

These physical AI systems must sense, decide, act and adapt safely in real-world environments, in real-time. Whether deployed in a robot, vehicle, factory, medical system or autonomous platform, each system requires four capabilities to operate together:

• Power to provide the energy foundation that enables intelligent systems to operate
• Sense to perceive and understand the physical environment
• Control to execute decisions through precise real-world actions
• Connected Compute to process, share and continuously adapt information at the edge

As this transition happens, many of these same technologies onsemi developed for automotive and industrial applications can be applied to this emerging market. onsemi’s ability to combine these capabilities through system-level co-design and optimize performance across the full stack, positions it to deliver differentiated solutions and capture a larger share of the value created by physical AI.

“The most attractive opportunities of the next decade are emerging as markets converge around the same technologies,” El-Khoury said. “The ability to efficiently deliver power, sense the environment and enable intelligent decision-making will define the next generation of intelligent machines. Our differentiated technology platforms enable us to solve power density across the device, intelligence and integration layers in a way no other semiconductor company can, positioning us to expand our content and grow as AI moves from infrastructure into the physical world.”

More Information:

• Shift in AI Power Architecture Expands onsemi’s Opportunity
• Extending onsemi’s Automotive Growth Engine to Physical AI
• onsemi’s Financial Transformation Gives Way to a New Era of Growth
• Video: onsemi Built to Break the Constraint
• Video: Simbe + onsemi: Autonomous Robotics Through Advanced Imaging
• Video: Siemens KACO and onsemi: Powering the Energy Infrastructure Behind AI
• onsemi Investor Day 2026

About Embedded Power Platform:

• onsemi Introduces the Embedded Power Platform, a Breakthrough Architecture for the AI Era
• Subaru to Evaluate onsemi’s Embedded Power Platform for Future EVs
• Media Assets: Embedded Power Platform
• About Embedded Power Platform
• Subaru and onsemi: Strengthening Vehicle Safety and Efficiency
• Video: Embedded Power Platform Transforms Power System Design
• Video: Expert Insights on the Embedded Power Platform 
• Video: Go Inside: EPP at Innovation Center Fab
• Technical Documentation: Embedded Power Platform

Caution Regarding Forward-Looking Statements

This press release includes “forward-looking statements,” as that term is defined in Section 27A of the U.S. Securities Act of 1933, as amended, and Section 21E of the U.S. Securities Exchange Act of 1934, as amended. All statements, other than statements of historical facts, included or incorporated in this press release could be deemed forward-looking statements, particularly statements about onsemi’s long term growth strategy; forecasts about the pace, scale and direction of technological change and its impact on onsemi’s total addressable market opportunity; statements about onsemi’s ability to capitalize on such an opportunity; and the potential impact of each of the foregoing on onsemi’s operating results and financial condition. Forward-looking statements are often characterized by the use of words such as “believes,” “estimates,” “sees,” “expects,” “projects,” “may,” “will,” “intends,” “plans,” “anticipates,” “targets,” “should,” “would” or similar expressions or by discussions of strategy, plans, expectations, projections or intentions. All forward-looking statements in this document are made based on onsemi’s current expectations, forecasts, estimates and assumptions and involve risks, uncertainties and other factors that could cause results or events to differ materially from those expressed in the forward-looking statements. Certain factors that could affect onsemi’s future results or events are described under Part I, Item 1A “Risk Factors” in the 2025 Annual Report on Form 10-K filed with the Securities and Exchange Commission (“SEC”) on February 9, 2026 (the “2025 Form 10-K”) and from time to time in onsemi’s other SEC reports. Readers are cautioned not to place undue reliance on forward-looking statements. onsemi assumes no obligation to update such information, which speaks only as of the date made, except as may be required by law.

Investing in onsemi’s securities involves a high degree of risk and uncertainty, and you should carefully consider the trends, risks and uncertainties described in this press release, onsemi’s 2025 Form 10-K and other reports filed with or furnished to the SEC before making any investment decision with respect to onsemi’s securities. If any of these trends, risks or uncertainties actually occurs or continues, onsemi’s business, financial condition or operating results could be materially adversely affected, the trading price of onsemi’s securities could decline, and you could lose all or part of your investment. All forward-looking statements attributable to onsemi or persons acting on onsemi’s behalf are expressly qualified in their entirety by this cautionary statement.

Contacts
        
Krystal Heaton
Director, Head of Public Relations
onsemi
(480) 242-6943
Krystal.Heaton@onsemi.com

Photos accompanying this announcement are available at 

https://www.globenewswire.com/NewsRoom/AttachmentNg/53d56e16-9287-4ed4-a9af-4d87a7f99eb8

https://www.globenewswire.com/NewsRoom/AttachmentNg/6dd6cbc0-9c09-46cd-84ac-fe9f27ce86ce 

Strategic technology engagement will explore the potential of advanced power integration for future electrified-vehicle architectures

Summary

Subaru has entered into a strategic technology engagement with onsemi on its Embedded Power Platform (EPP), marking an important milestone in the evaluation of next-generation power architectures for future electrified vehicles. Through early access to engineering samples, simulation models and technical expertise, Subaru will assess how a more integrated approach to power system design would improve efficiency, simplify development and support future vehicle architectures.

SCOTTSDALE, Ariz., Sept. 16, 2026 (GLOBE NEWSWIRE) — onsemi today announced a strategic technology engagement with Subaru Corporation to evaluate its Embedded Power Platform (EPP). The engagement will give Subaru early access to EPP technology and engineering expertise as the company explores next-generation power architectures for future electrified vehicles.

Power electronics are playing an increasingly important role in vehicle performance, efficiency and design flexibility as automakers expand their electrified vehicle portfolios. The engagement enables Subaru to explore how advances in power semiconductor integration can support broader system-level optimization, including new approaches to power system architecture, efficiency and vehicle design flexibility, while providing onsemi with practical customer insights to support the continued development of EPP.

“Advancing our electrification strategy requires us to continually assess technologies that can improve vehicle performance, efficiency and system integration,” said Tamotsu Inui, Managing Executive Officer Chief General Manager of Engineering Div, Chief General Manager of Technical Research Center, Subaru. “Our early engagement with onsemi gives us an opportunity to evaluate EPP’s integrated approach to power system design while drawing on onsemi’s modeling, simulation and engineering expertise. We are encouraged by the platform’s potential and look forward to continuing our technical engagement as we develop future electrified-vehicle architectures.”

“The transition to electrification is driving increasingly sophisticated vehicle architectures and placing growing pressure on automakers to improve efficiency, simplify development and accelerate innovation. That is creating an opportunity to rethink power systems from the ground up,” said Dinesh Ramanathan, Senior Vice President of Corporate Strategy, onsemi. “Subaru’s engagement brings valuable customer insight to EPP’s continued evolution, using the platform in advanced customer systems and exploring how its integrated power architecture would support the next generation of electrified vehicles.”

Potential Benefits for Future Electrified Vehicles

EPP is a breakthrough power platform that enables more power in less space by embedding multiple semiconductor devices directly into a silicon-based wafer-level package. By transforming the package from a passive housing into an active contributor to electrical and thermal performance, EPP enables a new class of highly integrated power systems designed for the growing demands of vehicle electrification.

For future electrified vehicles, EPP has the potential to support smaller, lighter and more efficient traction inverter systems while reducing development complexity and accelerating time to market. Because the platform can scale across multiple power levels using a common architecture, automakers can reduce engineering effort, minimize requalification costs and accelerate development cycles. The result is a faster path from concept to production, with lower development costs and greater flexibility across future vehicle programs.

These potential advantages are what make early technical collaboration so important. Building on a longstanding relationship between Subaru and onsemi, the collaboration reflects the companies’ shared commitment to advancing technologies that will shape the next generation of vehicle electrification and helping bring those technologies to realization. The initial phase focuses on early engineering evaluation and technical learning as the companies explore advances in power-semiconductor integration that can translate into scalable system-level solutions that meet the performance, efficiency and thermal demands of next-generation mobility.

More Information: 

• onsemi Charts Path to Power the Next Decade of Innovation
• Shift in AI Power Architecture Expands onsemi’s Opportunity  
• Extending onsemi’s Automotive Growth Engine to Physical AI  
• onsemi’s Financial Transformation Gives Way to a New Era of Growth  
• Video: onsemi Built to Break the Constraint
• Video: Simbe + onsemi: Autonomous Robotics Through Advanced Imaging
• Video: Siemens KACO and onsemi: Powering the Energy Infrastructure Behind AI
• onsemi Investor Day 2026

About Embedded Power Platform:

• onsemi Introduces the Embedded Power Platform, a Breakthrough Architecture for the AI Era
• Subaru to Evaluate onsemi’s Embedded Power Platform for Future EVs

• Media Assets: Embedded Power Platform
• About Embedded Power Platform
• Subaru and onsemi: Strengthening Vehicle Safety and Efficiency
• Video: Embedded Power Platform Transforms Power System Design
• Video: Expert Insights on the Embedded Power Platform 
• Video: Go Inside: EPP at Innovation Center Fab
• Technical Documentation: Embedded Power Platform

About onsemi
onsemi (Nasdaq: ON) delivers intelligent power and sensing technologies that enable electrification, energy efficiency, safety, and automation across automotive, industrial, and AI data center end-markets. With a highly differentiated and innovative product portfolio, onsemi helps customers solve complex challenges to achieve higher efficiency, improved performance and lower system cost, while supporting a safer, cleaner, and more energy efficient world. The company is part of the S&P 500^® index. Learn more at www.onsemi.com.

onsemi and the onsemi logo are trademarks of Semiconductor Components Industries, LLC. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders. Although the Company references its website in this news release, information on the website is not to be incorporated herein.

Contacts

Krystal Heaton
Director, Head of Public Relations
onsemi
(480) 242-6943
Krystal.Heaton@onsemi.com

Photos accompanying this announcement are available at

https://www.globenewswire.com/NewsRoom/AttachmentNg/9bd1c33b-421b-4a96-9f28-6fa17f103744

https://www.globenewswire.com/NewsRoom/AttachmentNg/68ea0cf7-f8e9-4540-9ce1-23cae9c8d9e5

Platform uses silicon wafer itself as the package and introduces a highly integrated approach to power system design across automotive, industrial, and AI data center markets

Summary: onsemi today unveiled the Embedded Power Platform (EPP), redefining system power delivery through unprecedented power density and integration of multiple dies into a single silicon device. By jointly optimizing electrical, mechanical and thermal performance within a single architecture, EPP enables up to 3 – 5x higher power density compared with current solutions with a highly integrated approach to power system design. This helps customers reduce complexity while scaling for the increasing demands of AI infrastructure and electrification.

SCOTTSDALE, Ariz., Sept. 16, 2026 (GLOBE NEWSWIRE) — onsemi today unveiled the Embedded Power Platform (EPP), a breakthrough architecture that uses the silicon wafer itself as the foundation of the package and introduces a highly integrated approach to power system design. Designed as a scalable platform, EPP brings electrical, mechanical and thermal design together from the outset to help customers achieve higher power density, improve system performance and accelerate development in AI, electrification and autonomous applications.

“For decades, the semiconductor and the package have been treated as separate technologies. EPP changes that by making the silicon itself part of the system architecture,” said Hassane El-Khoury, President and CEO of onsemi. “EPP brings together advanced semiconductor technologies, manufacturing and system-level optimization into a common architecture that can evolve alongside future innovations. This approach can redefine how power systems are built and create a new foundation for AI infrastructure, electrification and automation.”

What’s New: EPP reimagines the package from passive housing into an active contributor to system performance. By using the silicon wafer itself as the package, EPP enables the seamless integration and interconnection of silicon, silicon carbide (SiC) and gallium nitride (GaN) technologies within a highly integrated wafer-level architecture. Multiple devices, including FETs, drivers and controllers, can be embedded together in a single package and co-optimized for electrical, thermal and mechanical performance. This enables complete power-system co-design, allowing electrical, thermal and mechanical characteristics to be evaluated and optimized together from day one. The result is higher power density, improved system performance, reduced development complexity and faster time-to-market.

EPP also leverages onsemi’s standard 12-inch silicon wafer manufacturing capabilities, bringing key integration processes into the precision and control of the semiconductor fab. This applies mature semiconductor design tools, wafer-level manufacturing and advanced simulation capabilities to power-system integration, helping improve performance while accelerating innovation.

Subaru Corporation is one of the first early engagement partners for EPP, working with onsemi to evaluate how the platform could support future electrified vehicle architectures. Through the collaboration, Subaru will gain early access to engineering samples, simulation models and technical expertise as the companies explore opportunities to improve vehicle performance, streamline development and accelerate innovation.

Why It Matters: AI infrastructure, electrified transportation, industrial automation are all competing for the same critical resource: power. Customers need to move and manage more electricity within increasingly compact systems while controlling heat, efficiency, cost and development time. Yet many of today’s power systems are still developed using traditional design approaches that treat power electronics, mechanical design and thermal design as separate engineering challenges, with each layer optimized independently and sequentially. Decisions made at one stage can create compromises in another, leading to additional engineering iterations, costly late-stage changes and longer development cycles.

EPP replaces that sequential model with a common platform that can be co-designed, co-simulated and co-optimized. This approach is designed to help customers:

• • Achieve 3 – 5x higher power density, depending on the application
  • Accelerate development cycles to as little as four months
  • Improve thermal performance and heat dissipation
  • Reduce electrical losses through lower parasitic inductance
  • Enable greater device control and higher switching frequencies
  • Identify design trade-offs earlier and reduce costly late-stage changes
  • Scale a common architecture across power levels, device types, applications semiconductor technologies

• AI Infrastructure Applications: As AI rack power increases, more space and cooling capacity must be dedicated to the systems that deliver, convert and protect that power. This can limit how much compute capacity can fit within a rack. In an early EPP-based solid-state circuit-breaker design, the solution was approximately 50% smaller and 20% cooler than existing designs. By reducing packaging overhead and using the full EPP footprint to conduct heat, EPP can support more compact power systems, improve thermal management and enable greater power density in AI infrastructure.
• Electric Vehicle Applications: Electric vehicle traction inverters are often constrained by efficiency losses, thermal limitations, development complexity and system size. EPP addresses these challenges with up to 4x higher power density and 15% lower power losses compared to conventional approaches, enabling smaller, lighter and more efficient inverter designs. Its scalable architecture supports a single inverter platform spanning low-end to high-end vehicle applications, allowing automakers to reuse a common design across multiple vehicle models and power classes. This approach can reduce R&D and manufacturing costs, accelerate qualification and development cycles, improve vehicle range or lower system costs, and help bring new vehicle programs to market faster.

The AI era is creating new infrastructure challenges that cannot be solved by computing power alone. As power becomes one of the defining constraints on future innovation, EPP represents a fundamentally new approach to how energy is delivered, managed and optimized. By turning the silicon wafer into the package itself, onsemi is establishing a foundation for the next generation of AI, electrification and autonomous systems.

Availability: EPP is expected to begin sampling in 2026 with strategic customers and ecosystem participants across automotive and AI applications.

More Information:

• onsemi Charts Path to Power the Next Decade of Innovation
• Shift in AI Power Architecture Expands onsemi’s Opportunity
• Extending onsemi’s Automotive Growth Engine to Physical AI
• onsemi’s Financial Transformation Gives Way to a New Era of Growth
• Video: onsemi Built to Break the Constraint
• Video: Simbe + onsemi: Autonomous Robotics Through Advanced Imaging
• Video: Siemens KACO and onsemi: Powering the Energy Infrastructure Behind AI
• onsemi Investor Day 2026

About Embedded Power Platform:

• onsemi Introduces the Embedded Power Platform, a Breakthrough Architecture for the AI Era
• Subaru to Evaluate onsemi’s Embedded Power Platform for Future EVs
• Media Assets: Embedded Power Platform
• About Embedded Power Platform
• Subaru and onsemi: Strengthening Vehicle Safety and Efficiency
• Video: Embedded Power Platform Transforms Power System Design
• Video: Expert Insights on the Embedded Power Platform 
• Video: Go Inside: EPP at Innovation Center Fab
• Technical Documentation: Embedded Power Platform

About onsemi

onsemi (Nasdaq: ON) delivers intelligent power and sensing technologies that enable electrification, energy efficiency, safety, and automation across automotive, industrial, and AI data center end-markets. With a highly differentiated and innovative product portfolio, onsemi helps customers solve complex challenges to achieve higher efficiency, improved performance, and lower system cost, while supporting a safer, cleaner, and more energy-efficient world. onsemi is part of the S&P 500^® index. Learn more about onsemi at www.onsemi.com.

onsemi and the onsemi logo are trademarks of Semiconductor Components Industries, LLC. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders.

Contacts
        
Krystal Heaton
Director, Head of Public Relations
onsemi
(480) 242-6943
Krystal.Heaton@onsemi.com

Photos accompanying this announcement are available at: 
https://www.globenewswire.com/NewsRoom/AttachmentNg/493dcb4e-d494-476b-b82f-8744b69b9479

https://www.globenewswire.com/NewsRoom/AttachmentNg/45506b9c-a7fa-4412-ac06-3fd4480375f3