MALAGA, Spain–(BUSINESS WIRE)–Lumentum Holdings Inc. (“Lumentum”) today announced plans for a joint demonstration together with Qualcomm Technologies, Inc. and Corning Incorporated (NYSE: GLW) of a high-density die-to-die (D2D) optical interconnect showcase for AI scale-up architectures at ECOC 2026. The board-level demonstration will combine a D2D interface IP subsystem from Qualcomm Technologies with Lumentum’s VCSEL-based optical interconnect platform and Corning multimode fiber connectivi