Month: September 2026

References are made to the stock exchange announcements by AKVA group ASA (AKVA) on 30 June 2026 and 3 August 2026 regarding the merger of Submerged AS (as the non-surviving entity) with AKVA (as the surviving entity).

The merger was completed on 23 September 2026 upon registration of the merger by the Norwegian Register of Business Enterprises.

This information is subject to the disclosure requirements pursuant to section 4.2.4 of Oslo Rule Book II – Issuer Rules, cf. section 5-12 of the Norwegian Securities Trading Act.

Dated: 23 September 2026

AKVA group ASA
Web: www.akvagroup.com

CONTACTS:

Knut Nesse     Chief Executive Officer
Phone:    +47 51 77 85 00
Mobile:    +47 91 37 62 20
E-mail:    knesse@akvagroup.com 

Ronny Meinkøhn     Chief Financial Officer

Phone:           +47 51 77 85 00
Mobile:          +47 98 20 67 76
E-mail:          rmeinkohn@akvagroup.com

Collaboration features high-speed SerDes, advanced packaging and SI/PI expertise

SAN JOSE, Calif., Sept. 23, 2026 (GLOBE NEWSWIRE) — Today at the TSMC 2026 North America Open Innovation Platform^® (OIP) Ecosystem Forum, Alchip Technologies presented a technical paper with Synopsys on how AI data center ASICs can overcome increasingly stringent bandwidth requirements as scale-up and out interfaces become critical to next‑generation system architectures. This approach brings together Synopsys 224G PHY IP with Alchip’s advanced packaging and signal integrity/power integrity (SI/PI) expertise in a protocol-agnostic physical design.

Breaking Through the Bandwidth Wall

As AI accelerators scale to meet growing performance demands, moving data on and off the chip fast enough becomes one of the hardest problems in the design. At 224 Gbps SerDes speeds, the presentation addressed several key physical design challenges:

• Die-edge congestion and escape routing complexity, along with signal and power integrity constraints across both die and package
• Limited die-edge real estate and asymmetric constraints between East/West (E/W) and North/South (N/S) edges
• Dense package substrate breakout requirements that must be met without degrading channel performance

The collaboration overcame these barriers through a coordinated optimization of escape routing, die-edge utilization, and package breakout — carefully balancing signal and power integrity requirements to maintain overall system performance. Differentiated handling of E/W and N/S die edges further ensured that maximum bandwidth per millimeter of die-edge beachfront was achieved at max reach, consistently across all die edges.

Building on this work, the analysis extended to E/W package breakout techniques needed to sustain 1.6 terabits per second (Tbps) of networking bandwidth, highlighting key routing density and SI/PI considerations at the substrate level. The resulting protocol-agnostic, forward-scalable physical design approach provides a foundation that can ultimately support 448G SerDes implementations.

Pushing Bandwidth Density to Its Physical Limits

Using this collaborative methodology, engineers achieved chip‑to‑chip interconnect bandwidth density approaching theoretical physical limits. This demonstrates the feasibility of ultra‑high‑density 224G scale‑up interconnect implementations within realistic die edge and package constraints.

These results point to broader implications for data center design, as AI accelerators and high‑performance networking ASICs continue to scale, maximizing bandwidth per millimeter directly impacts system throughput and scalability.

About Alchip

Alchip Technologies Ltd., founded in 2003 and headquartered in Taipei, Taiwan, is a leading global High-Performance Computing and AI infrastructure ASIC provider of IC and packaging design, and production services for companies developing complex and high-volume ASICs and SoCs.  Alchip provides faster time-to-market and cost-effective solutions for SoC design at mainstream and advanced process technology. Alchip has built its reputation as a high-performance ASIC leader through its advanced 2.5D/3D CoWoS packaging, chiplet design, and manufacturing management. Customers include global leaders in artificial intelligence, high-performance computing, supercomputing, mobile communications, entertainment device, networking equipment, and other electronic product categories. Alchip is listed on the Taiwan Stock Exchange (TWSE: 3661).

For more information, please visit our website: http://www.alchip.com

CONTACT: Charles Byers
Alchip Technologies
+ (408)-310-9244
chuck_byers@alchip.com

WHITE PLAINS, N.Y., Sept. 23, 2026 (GLOBE NEWSWIRE) — NorthEast Community Bancorp, Inc. (the “Company”) (Nasdaq: NECB) announced today that its Board of Directors has declared a quarterly cash dividend of $0.25 per common share. The dividend will be paid on or about November 13, 2026 to shareholders of record as of the close of business on October 9, 2026.  

About NorthEast Community Bancorp, Inc.

NorthEast Community Bancorp, headquartered at 325 Hamilton Avenue, White Plains, New York 10601, is the holding company for NorthEast Community Bank, which conducts business through its eleven branch offices located in Bronx, New York, Orange, Rockland, and Sullivan Counties in New York and Essex, Middlesex, and Norfolk Counties in Massachusetts and three loan production offices located in New City, New York, White Plains, New York, and Danvers, Massachusetts. For more information about NorthEast Community Bancorp and NorthEast Community Bank, please visit www.necb.com.

Cautionary Note About Forward-Looking Statements

This press release contains certain forward-looking statements. Forward-looking statements include statements regarding anticipated future events and can be identified by the fact that they do not relate strictly to historical or current facts. They often include words such as “believe,” “expect,” “anticipate,” “estimate,” and “intend” or future or conditional verbs such as “will,” “would,” “should,” “could,” or “may.” These statements are based upon the current beliefs and expectations of the Company’s management and are subject to significant risks and uncertainties. Actual results may differ materially from those set forth in the forward-looking statements as a result of numerous factors. Factors that could cause actual results to differ materially from expected results include, but are not limited to, changes in market interest rates, regional and national economic conditions (including higher inflation and its impact on regional and national economic conditions), legislative and regulatory changes, monetary and fiscal policies of the United States government, including policies of the United States Treasury and the Federal Reserve Board, the quality and composition of the loan or investment portfolios, demand for loan products, decreases in deposit levels necessitating increased borrowing to fund loans and securities, competition, demand for financial services in NorthEast Community Bank’s market area, changes in the real estate market values in NorthEast Community Bank’s market area, the impact of failures or disruptions in or breaches of the Company’s operational or security systems, data or infrastructure, or those of third parties, including as a result of cyberattacks or campaigns, and changes in relevant accounting principles and guidelines. Additionally, other risks and uncertainties may be described in our annual and quarterly reports filed with the U.S. Securities and Exchange Commission (the “SEC”), which are available through the SEC’s website located at www.sec.gov. These risks and uncertainties should be considered in evaluating any forward-looking statements and undue reliance should not be placed on such statements. Except as required by applicable law or regulation, the Company does not undertake, and specifically disclaims any obligation, to release publicly the result of any revisions that may be made to any forward-looking statements to reflect events or circumstances after the date of the statements or to reflect the occurrence of anticipated or unanticipated events.

CONTACT:		Kenneth A. Martinek
		Chairman and Chief Executive Officer
PHONE:		(914) 684-2500