Originally published by IEEE Spectrum
By Dina Genkina
In their lab in Newark, Del., the Chemours team has placed several high-power servers in tanks filled with a proprietary, specially formulated fluid. The fluid is dielectric, so as not to cause shorts, and it’s also noncorrosive and designed to boil at the precise temperature at which the chips are to be held. The fluid boils directly on top of the hot chips. Then the vapor condenses on a cooled surface, either at the top or the back panel of the tank.
That condenser is cooled with circulating facility water. “All we need is water sent directly to the tank that’s about 6 degrees lower than our boiling point, so about 43 °C,” Marshall says. “The fluid condenses [back to a liquid] right inside of the tank. The temperature required to condense our fluid can eliminate the need for chillers and other complex mechanical infrastructure in most cases.”
According to a recent case study by Chemours researchers, two-phase immersion cooling is more cost effective than single-phase immersion or single-phase direct-to-chip in most climates. For example, in Ashburn, Va., the 10-year total cost of ownership was estimated at US $436 million for a single-phase direct-to-chip setup, $491 million for a single-phase immersion setup, and $433 million for a two-phase immersion-cooling setup, mostly due to lower power requirements and a simplified mechanical system.
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