Fibocom lance le premier SC151-GL de l’industrie au MWC Shanghai 2023, accélérant la commercialisation mondiale de la 5G AIoT grâce à un module intelligent hautement intégré

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Au cours du MWC Shanghai 2023, Fibocom annonce le lancement de son module intelligent 5G, le SC151-GL, équipé du processeur Qualcomm® QCM4490. La version mondiale du SC151-GL vise à fournir une solution « one unit fits for world » pour les marchés de la 5G AIoT, et permet aux terminaux…

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