Fibocom Launches the Industry-first SC151-GL at MWC Shanghai 2023, Accelerating the Global 5G AIoT Commercialization with One Highly Integrated Smart Module

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During MWC Shanghai 2023, Fibocom announces the launch of its 5G smart module SC151-GL empowered by the Qualcomm® QCM4490 Processor. The global version of SC151-GL aims to provide a “one unit fits for world” solution for 5G AIoT markets, and enables the access of mobile smart terminals to…

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