Molex Unveils First-to-Market, Chip-to-Chip 224G Product Portfolio to Accelerate Support for Next-Gen Data Centers & Generative AI Applications

High-speed I/O, genderless backplane cables, mezzanine board-to-board connectors and near-ASIC connector-to-cable solutions speed path to 224 Gbps-PAM4 Predictive analytics, customer collaborations and simulations drove full channel development of individual modules to ensure highest…