MZ Technologies Unveils Next Generation Chiplet/Package Design Tool

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GENIO EVO Tackles Advanced Packaging Thermal and Mechanical Roadblocks ROME, Jan. 14, 2025 /PRNewswire/ — MZ Technologies, a leading supplier of innovative solutions and methodologies for 2.5 and 3D design, today unveiled GENIO EVO, the first integrated chiplet/package EDA tool to…

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