Wire Bonder Equipment Market to grow by USD 227.5 Million from 2024-2028, AI-powered report by Technavio highlights rising global electronics production as key driver

NEW YORK, Oct. 7, 2024 /PRNewswire/ — Report on how AI is driving market transformation- The global wire bonder equipment market size is estimated to grow by USD 227.5 mn from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of over 3.32% during the forecast…