Molex Releases Report on Thermal Management Challenges and Opportunities for I/O Modules amid Emerging Solutions for Next-Gen Data Center Cooling

Fueled by heightened demand for the fastest data rates, optical I/O module power requirements push traditional forced-air cooling to operational limits Shift to 224 Gbps PAM-4 interconnects creates nearly a 4X increase in power density, increasing thermal management costs and complexities…

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