Mosaic Microsystems Announces Strategic Hire: Andrew Garland Joins as Sr. Process Engineer to Drive Next-Gen Glass Interposer Packaging Solutions

ROCHESTER, N.Y., April 11, 2024 /PRNewswire/ — Mosaic Microsystems, a leader in the field of microelectronic glass packaging solutions using glass substrate, announced today the addition of Andrew Garland to its engineering team as a process engineer. With a rich background in image…